TY - CONF T1 - A new back-to-back graded AlGaN barrier for complementary integration technique based on GaN/AlGaN/GaN platform JO - 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) UR - http://dx.doi.org/10.1109/edtm55494.2023.10103055 PY - 2023/03/07 AU - Zhou J AU - Do H-B AU - De Souza MM ED - DO - DOI: 10.1109/edtm55494.2023.10103055 PB - IEEE Y2 - 2025/05/19 ER -