TY - JOUR T1 - Non-destructive mapping of stress and strain in soft thin films through sound waves JO - Communications Physics UR - http://dx.doi.org/10.1038/s42005-022-01000-3 PY - 2022/09/17 AU - Li G-Y AU - Gower AL AU - Destrade M AU - Yun S-H ED - DO - DOI: 10.1038/s42005-022-01000-3 PB - Springer Science and Business Media LLC VL - 5 IS - 1 Y2 - 2025/05/25 ER -